An edition of Quality Conformance and Qualification of Microelectronic Packages and Interconnects
(1994)
Quality conformance and qualification of microelectronic packages and interconnects
by Evans, John W., Abhijit Dasgupta, Jillian Y. Evans, and Michael Pecht
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Electronic packaging, Quality assurance, Defects, Quality control, TestingShowing 1 featured edition. View all 1 editions?
| Edition | Availability |
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1
Quality conformance and qualification of microelectronic packages and interconnects
1994, Wiley
in English
0471594369 9780471594369
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Edition Notes
Includes bibliographical references (p. 419-450) and index.
"A Wiley-Interscience publication."
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| November 16, 2020 | Edited by MARC Bot | import existing book |
| August 18, 2020 | Created by ImportBot | import existing book |